TOKYO, Dec 20 (News On Japan) –
Rapidus President Koike has unveiled what the company says is the world’s first next-generation semiconductor substrate measuring 600 millimeters on each side, marking a significant step forward for Japan’s emerging chipmaker.
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The newly developed substrate, which uses glass as its base material, can accommodate and be cut into more than ten times the number of AI-focused semiconductors compared with conventional substrates, a feature expected to dramatically improve production efficiency.
Rapidus plans to further advance the development of cost-competitive semiconductor substrates, with the aim of leveraging the technology to secure major customers in 2026 as global demand for high-performance AI chips continues to expand.
Source: テレ東BIZ
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